DOI: 10.14489/td.2014.011.pp.070-072 

Vavilov V.P., Shiryaev V.V., Kashirov A.V.
ACTIVE THERMAL INSPECTION OF HEAT SINK QUALITY IN RADIOELECTRONICS
(pp. 70-72)

Abstract. The task of ensuring optimal heat sink in operating electronic component is always actual and has some aspects. This paper reports some preliminary results which illustrate the possibility of using active thermal nondestructive testing for express inspection of thermally-conductive adhesive layers in the electronic devices used in the aerospace where a lack of convection makes the heat sink by means of heat conduction especially important. The paper describes theoretical and experimental results on the detection of defects with size over 7×7 mm and thickness 0,1–0,3 mm in a thermally-conductive adhesive between two 2.7 mm-thick aluminium plates by applying pulsed thermal stimu-lation with Bowens Xenon tubes. Temperature acquisition was accomplished by using a NEC Avio TH-9100 and FLIR SC7700M infrared imagers.

Keywords: аctive thermal testing, aluminium, thermally-conductive adhesive, defect.